ERSASCOPE 2 |
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 ERSASCOPE 2 Flip Chip Optic (patented) - Applications |
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ERSASCOPE 2 - Optical Innovation follows component miniaturization!
The revolutionary Flip Chip optical lens has the smallest foot print in the industry (4.0 x 0.60 mm) and has been specifically designed for use on densely packed PCBs.
Competitive BGA optical systems on the market typically have an aperture height of 0.300 mm to 0.400 mm. While suitable for BGA applications, such systems provide only a "look down view" of a Flip Chip whose standoff or gap height is typically smaller than 0.080 mm. The ERSASCOPE 2 Flip Chip head's aperture height is smaller than such gap heights, approx. 0.050 mm. This means that it is now possible to "look up" at even the top side of the Flip Chip joint! This critical part of the Flip Chip joint was never before seen by any BGA optical inspection equipment on the market! Additionally, the lower iris now allows for interior joint inspection of low profile CSP and Flip-Chip components.
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